COM-45SP
COM Express CPU Module with Intel Core 2 Duo/ Celeron M (Socket-P Based) Processors
Features
- Intel® Core™ 2 Duo/ Celeron® M (Socket-P Based) Processors
- Intel® GM45 + ICH9M
- Dual-channel DDRIII 800/1066 Memory, Max. 8GB
- Gigabit Ethernet
- CRT, Up to 24-bit Dual-channel LVDS LCD, TV, Display Port, HDMI, DVI
- High Definition Audio Interface
- SATA II x 4
- USB2.0 x 8
- PCI x 4, PCI-Express [x16] x 1, PCI-Express [x1] x 5
- Wide DC Input Range, +8.5V to +19V
- COM Express Basic Module Pin-out Type II
Overview
To accommodate fast growing marketing segments, AAEON has developed a brand new COM (Computer-on-module) Express CPU Module. The COM-45SP, and its accompanying carrier board-ECB-916M, adopts Intel Core 2 Duo/ Celeron M (socket-P based) processor and Intel's GM45+ICH9M chipset, offering high speed PCI-Express(x16) and PCI-Express(x1) bus interfaces for your high performance applications requiring high-speed and greater stability. The COM Express CPU Module offers flexibility and time-to-market advantages over a fully customized platform.
AAEON's COM-45SP supports 24-bit dual-channel LVDS LCD interface and supports two DDRIII 800/1066 SODIMM memory module up to 8GB. A high definition audio interface is available to connect to an audio codec on the carrier board. Moreover, four SATA II interfaces are featured giving the user flexibility in storage choices.
To satisfy the requirements of leading-edge applications in gaming, entertainment, industrial automation, medical, and POS, etc, COM Express carrier boards can be designed with features and technologies specifically targeting the needs of the different market segments. AAEON can design your COM Express carrier board to meet your specific project requirements.
| part number | description | status |
| TF-COM-45SP-A10 | COM Express.Socket P.Dual DDRIII.GbE.USB 2.0.Rev.A1.0 |
| accessories and options | ||
| TF-PER-A016 | CPU Cooler.For COM Express Module.Socket-type CPU | |
| TF-PER-A017 | CPU Cooler for COM Express Module Onboard CPU | |
| TF-PER-A018 | Heat Spreader Kit.For COM Express Module.Socket-type CPU | |
| TF-PER-A019 | Heat Spreader Kit.For COM Express Module.On-board CPU | |
| TF-PER-A021 | Passive Heat-sink for COM Express Module Socket type CPU | |
| TF-PER-A022 | Passive Heat-sink.For COM Express Module.On-board CPU | |
| TF-PER-A023 | CPU Cooler For COM Express Module Socket-type CPU High TDP | |
| TF-PER-A024 | CPU Cooler for COM Expres Module Onboard CPU High TDP | |
| TF-PER-A032 | Heat Spreader Kit.For COM Express Module.Socket-type CPU.Standoffs with threads | |
| TF-PER-A033 | Heat Spreader Kit.For COM Express Module.On-board CPU.Standoffs with threads | |
| TF-PER-A042 | Heat Spreader Kit.For COM Express Module.On-board CPU.Standoffs with threads | |
| TF-PER-A051 | CPU Cooler.For COM-965 & COM-45SP Socket-P type CPU | |
| TF-PER-A067 | Passive Heat-sink.For COM-965/COM-45SP.On-board CPU | New |
| TF-PER-A082 | Passive Heat-sink.For COM-965/COM-45SP.Socket-type CPU | New |
