Overview
To accommodate fast growing marketing segments, AAEON has developed a brand new COM (Computer-on-module) Express CPU Module. The COM-965, and its accompanying carrier board-ECB-916M, adopts Intel Core 2 Duo/ Celeron M (Socket-P based) processors and Intel's GME965 chipset, offering high speed PCI-Express bus interface and serial ATA for your high performance applications requiring high-speed and greater stability. The COM Express CPU Module offers flexibility and time-to-market advantages over a fully customized platform.
AAEON's COM-965 supports up to 24-bit dual-channel LVDS interface and supports two DDRII 533/667 SODIMM memory module up to 4GB. A high definition audio interface is available to connect to an audio codec on the carrier board. Moreover, one PATA and three SATA interfaces are featured giving the user flexibility in storage choices.
To satisfy the requirements of leading-edge applications in gaming, entertainment, industrial automation, medical, and POS, etc, COM Express carrier boards can be designed with features and technologies specifically targeting the needs of the different market segments. AAEON can design your COM Express carrier board to meet your specific project requirements.To accommodate fast growing marketing segments, AAEON has developed a brand new COM (Computer-on-module) Express CPU Module. The COM-965, and its accompanying carrier board-ECB-916M, adopts Intel Core 2 Duo/ Celeron M (Socket-P based) processors and Intel's GME965 chipset, offering high speed PCI-Express bus interface and serial ATA for your high performance applications requiring high-speed and greater stability. The COM Express CPU Module offers flexibility and time-to-market advantages over a fully customized platform.
AAEON's COM-965 supports up to 24-bit dual-channel LVDS interface and supports two DDRII 533/667 SODIMM memory module up to 4GB. A high definition audio interface is available to connect to an audio codec on the carrier board. Moreover, one PATA and three SATA interfaces are featured giving the user flexibility in storage choices.
To satisfy the requirements of leading-edge applications in gaming, entertainment, industrial automation, medical, and POS, etc, COM Express carrier boards can be designed with features and technologies specifically targeting the needs of the different market segments. AAEON can design your COM Express carrier board to meet your specific project requirements.
| accessories and options |
| TF-PER-A016 |
CPU Cooler.For COM Express Module.Socket-type CPU |
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| TF-PER-A017 |
CPU Cooler for COM Express Module Onboard CPU |
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| TF-PER-A018 |
Heat Spreader Kit.For COM Express Module.Socket-type CPU |
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| TF-PER-A019 |
Heat Spreader Kit.For COM Express Module.On-board CPU |
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| TF-PER-A021 |
Passive Heat-sink for COM Express Module Socket type CPU |
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| TF-PER-A022 |
Passive Heat-sink.For COM Express Module.On-board CPU |
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| TF-PER-A023 |
CPU Cooler For COM Express Module Socket-type CPU High TDP |
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| TF-PER-A024 |
CPU Cooler for COM Expres Module Onboard CPU High TDP |
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| TF-PER-A032 |
Heat Spreader Kit.For COM Express Module.Socket-type CPU.Standoffs with threads |
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| TF-PER-A033 |
Heat Spreader Kit.For COM Express Module.On-board CPU.Standoffs with threads |
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| TF-PER-A042 |
Heat Spreader Kit.For COM Express Module.On-board CPU.Standoffs with threads |
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| TF-PER-A051 |
CPU Cooler.For COM-965 & COM-45SP Socket-P type CPU |
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| TF-PER-A052 |
CPU Cooler.For COM-965/COM-45SP.On-board CPU.12V Fan |
|
| TF-PER-A067 |
Passive Heat-sink.For COM-965/COM-45SP.On-board CPU |
New |
| TF-PER-A082 |
Passive Heat-sink.For COM-965/COM-45SP.Socket-type CPU |
New |
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